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“Semiconductor Packaging: Materials Interaction and Reliability (English Edition)”,作者:[Andrea Chen, Randy Hsiao-Yu Lo]

Semiconductor Packaging: Materials Interaction and Reliability (English Edition) 1第一 版本, Kindle电子书

3.3 颗星,最多 5 颗星 6 评论

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目录

SEMICONDUCTOR PACKAGES History and Background Objectives Introduction Brief history Wire bonding process flow Flip-chip process flow comparison Equipment Material interactions Package Form Factors and Families Objectives Introduction Package outline standardization Leaded package families Quad lead package family Substrate-based package families Chip scale packages Stacked-die package family Package-on-package and related variations Flip-chip packages Wafer-level chip scale packages Surface-Mount Technology Objectives Introduction Background Package cracking or "popcorning" Surface-mount packages: peripheral leads versus area array Issues with advanced packaging Current and future trends Other Packaging Needs Objectives Introduction Tape automated bonding Micro electro-mechanical systems (MEMS) Image sensor modules Memory cards Packaging needs for solar technology PACKAGE RELIABILITY Reliability Testing Introduction Background Examples of reliability tests Limitations of reliability testing MATERIALS USED IN SEMICONDUCTOR PACKAGING Polymers Molding compounds Die attach adhesives Underfill materials Organic substrates Metals Lead frames, heat spreaders, and heat sinks Bonding wires Solders Wafer bumping Ceramics and Glasses Objectives Introduction Types of ceramics used in semiconductor packaging Types of glasses used in semiconductor packaging THE FUTURE Trends and Challenges Objectives Introduction Copper interconnects and low- dielectric materials Dielectric constant requirements at each technology node Future interconnect and dielectric materials Future packaging options Light-Emitting Diodes Objectives Introduction Unique characteristics of light-emitting diode (LED) packaging needs Reliability requirements for LED packages Appendix A: Analytical Tools Appendix B: Destructive Tools and Tests Index Bibliography appears at the end of each chapter. --此文字指其他 kindle_edition 版本。

媒体推荐

Meticulously written and organized ... this book has everything needed to develop a complete understanding of semiconductor packaging, particularly how materials interact with one another. ... this book is easy to read and, more importantly, easy to understand ... Particularly valuable are the appendices from the chapter describing analytical tools, what they are and how they are used and the chapter on destructive tools and tests. ... whether an experienced engineer involved in electronic packaging or a novice, you need to make sure that this volume is a part of your technical library. -Dan Beaulieu, D.B. Management Group, in I-Connect007, December 2011 This book provides a complete and systematic discussion of key materials used in electronic packages. Unlike most of its competitors which are composed by several contributors, this book is written by two authors who are well-respected veterans in the electronic package industry. Therefore, consistency and easy to follow for new engineers and students will be the most distinguishing features for this book. -Kevin K.L. Chen, Qualcomm Atheros, San Jose, California, USA This book gives a good general overview of materials used in the making of semiconductor packages. The text covers both individual material types and their performance requirements in the end product. Also discussed are the historical background, purpose, key material properties, various material interactions, reliability requirements, and future trends. The book is easy to read and would serve as an excellent introduction to the subject for a student or engineer unfamiliar with the topic. It would also serve as a handy reference guide for a basic understanding of semiconductor packaging materials, as well of semiconductor packaging itself. -Zemo Yang, Ambarella Corp, Santa Clara, California, USA Materials technology is enabling the rapid development of new and advanced semiconductor packaging form factors. Knowledge of how material interactions impact package reliability and performance is ever more critical to the semiconductor industry, so both students and engineers need a resource to turn to in understanding material technology issues and trade-offs. This book serves as such a resource and reference guide to the world of semiconductor packaging materials. -Daniel P. Tracy, SEMI, San Jose, California, USA A great book for someone who quickly wishes to get up to speed in 1st level of semiconductor packaging. -Jack Belani, Vice President, Marketing and Sales, Contact Materials Division, Heraeus Materials Technology LLC --此文字指其他 kindle_edition 版本。

基本信息

  • ASIN ‏ : ‎ B00OD4G8AU
  • 出版社 ‏ : ‎ CRC Press; 第 1st 版 (2016年4月19日)
  • 出版日期 ‏ : ‎ 2016年4月19日
  • 语言 ‏ : ‎ 英语
  • 文件大小 ‏ : ‎ 11841 KB
  • 同步设备使用情况: ‏ : ‎ 根据出版商限制,最多 4 台同步设备
  • 标准语音朗读 ‏ : ‎ 未启用
  • X-Ray ‏ : ‎ 未启用
  • 生词提示功能 ‏ : ‎ 未启用
  • 纸书页数 ‏ : ‎ 216页
  • 用户评分:
    3.3 颗星,最多 5 颗星 6 评论

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美国亚马逊: 2.0 颗星,最多 5 颗星 1 条评论
ByungYeun Kim
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2015年4月8日 - 已在美国亚马逊上发表
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