In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
![“Semiconductor Packaging: Materials Interaction and Reliability (English Edition)”，作者：[Andrea Chen, Randy Hsiao-Yu Lo]](https://images-cn.ssl-images-amazon.cn/images/I/41FDfYWh6DL._SY346_.jpg)
跳至主要内容
%2520%25E4%25BD%259C%25E8%2580%2585%2520Andrea%2520Chen%2520%25EF%25BC%258C%25E7%258B%25AC%25E4%25B9%2590%25E4%25B9%2590%25E4%25B8%258D%25E5%25A6%2582%25E4%25BC%2597%25E4%25B9%2590%25E4%25B9%2590%25EF%25BC%2581%25E5%2588%2586%25E4%25BA%25AB%25E7%25BB%2599%25E5%25A4%25A7%25E5%25AE%25B6%25E3%2580%2582%26desc%3D%25E5%25BE%2597%25E6%259D%25A5%25E5%2585%25A8%25E4%25B8%258D%25E8%25B4%25B9%25E5%25B7%25A5%25E5%25A4%25AB~%25E6%2588%2591%25E5%259C%25A8%25E4%25BA%259A%25E9%25A9%25AC%25E9%2580%258AZ.cn%2520%25E6%2589%25BE%25E5%2588%25B0%25E4%25BA%2586%2520Semiconductor%2520Packaging%253A%2520Materials%2520Interaction%2520and%2520Reliability%2520(English%2520Edition)%2520%25E4%25BD%259C%25E8%2580%2585%2520Andrea%2520Chen%2520%25EF%25BC%258C%25E7%258B%25AC%25E4%25B9%2590%25E4%25B9%2590%25E4%25B8%258D%25E5%25A6%2582%25E4%25BC%2597%25E4%25B9%2590%25E4%25B9%2590%25EF%25BC%2581%25E5%2588%2586%25E4%25BA%25AB%25E7%25BB%2599%25E5%25A4%25A7%25E5%25AE%25B6%25E3%2580%2582%26url%3Dhttps%253A%252F%252Fwww.amazon.cn%252Fdp%252FB00OD4G8AU%252Fref%253Dcm_sw_r_qq_dp_XVQ841PYYE00Z0W5121P%26pics%3Dhttps%253A%252F%252Fimages-cn.ssl-images-amazon.com%252Fimages%252FI%252F41FDfYWh6DL.jpg%26site%3DAmazon&token=470ACDEDB7430F585F54AE6524C6DF19FE48945A){kind=link}
%2520%25E4%25BD%259C%25E8%2580%2585%2520Andrea%2520Chen%2520%25E3%2580%2582%26pic%3Dhttps%253A%252F%252Fimages-cn.ssl-images-amazon.com%252Fimages%252FI%252F41FDfYWh6DL.jpg%26url%3Dhttps%253A%252F%252Fwww.amazon.cn%252Fdp%252FB00OD4G8AU%252Fref%253Dcm_sw_r_si_dp_XVQ841PYYE00Z0W5121P%26appkey%3D620381579%26ralateUid%3D1732523361&token=FB6A9A9E00FF3830BFEB135C7D10C6B1079BB169){kind=link}
%2520%25E4%25BD%259C%25E8%2580%2585%2520Andrea%2520Chen%26title%3D%25E6%2588%2591%25E5%258F%25AA%25E8%25B4%25AD%25E4%25B9%25B0Semiconductor%2520Packaging%253A%2520Materials%2520Interaction%2520and%2520Reliability%2520(English%2520Edition)%2520%25E4%25BD%259C%25E8%2580%2585%2520Andrea%2520Chen%26pics%3Dhttps%253A%252F%252Fimages-cn.ssl-images-amazon.com%252Fimages%252FI%252F41FDfYWh6DL.jpg%26url%3Dhttps%253A%252F%252Fwww.amazon.cn%252Fdp%252FB00OD4G8AU%252Fref%253Dcm_sw_r_qz_dp_XVQ841PYYE00Z0W5121P&token=31FC8A30F291E13A019621998DC3F4291E81C5C9){kind=link}